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IEEE International Midwest Symposium on Circuits and Systems

MWSCAS 2020

URL: http://mwscas2020.org/
Event Date: 2020-08-09 ~ 2020-08-12
Submission Date: 2020-03-23
Location: Springfield, United States of America

CALL FOR PAPERS IEEE INTERNATIONAL MWSCAS 2020
The 63rd IEEE International Midwest Symposium on Circuits and Systems will be held at the Sheraton Hotel in
Springfield, MA, USA, August 9 – 12, 2020. Springfield is twenty minutes from Hartford CT Springfield/Hartford
airport (BDL) and an hour and forty-five minutes from Boston MA airport (BOS). The conference theme is Artificial Intelligence (AI) and the Internet of Things (IoT) — Making the Future Happen! MWSCAS 2020 will include oral and poster sessions, student paper contest, tutorials given by experts in circuits and systems topics, and special sessions.
IMPORTANT DEADLINE DATES
February 17: Tutorial and Special Session Proposal
Submission Deadline
March 23: Regular Paper Submission Deadline
March 23: Special session and invited paper deadline
May 26: Notice of Paper Acceptance
June 20: Camera-Ready Paper Due for all papers
Topics include, but are not limited to:
Track 1. Analog Circuits and Systems
1.1 Analog Circuits and Systems
1.2 Linear and Non-linear Analog Systems
1.3 Biomedical Electronics
1.4 Bioengineering Systems and Bio Chips
1.5 System Architectures
1.6 Neuromorphic Systems
1.7 Other Analog Circuits and systems
Track 2. Digital Circuits and Systems
2.1 Digital Integrated Circuits
2.2 System On a Chip (SOC) and Network on a Chip
(NOC)
2.3 Digital Filters
2.4 Hardware-Software Co-Design
2.5 Other Digital Circuits and Systems
Track 3. Communications Circuits and Systems
3.1 Communications Circuits, Computers and
Applications
3.2 Communications Systems and Control
3.3 Information Theory, Coding and Security
3.4 Communications Theory
3.5 Other Communications Circuits and Systems
Track 4. RF and Wireless Circuits and Systems
4.1 RF Front-End Circuits
4.2 Mixed-Signal RF and Analog and Baseline Circuits
4.3 Wireless Mobile Circuits and Systems and
Connectivity
4.4 VCO’s and Frequency Multipliers, PLL’s and
Synthesizers
4.5 Other RF and Wireless Circuits and Systems
Track 5. Sensor Circuits and Systems
5.1 Technologies for Smart Sensors
5.2 Sensor Fusion
5.3 Control Systems
5.4 Mechatronics and Robotics
5.5 Other Sensor Circuits and Systems
Track 6. Converter Circuits and Systems
6.1 Analog to Digital Converters
6.2 Digital to Analog Converters
6.3 DC-DC Converters
6.4 Other Converter Circuits and Systems
Track 7. Signal and Image Processing
7.1 Analog and Mixed Signal Processing
7.2 Digital Signal Processing
7.3 Signal Processing Theory and Methods
7.4 Image, Video and Multi-Dimensional Signal
Processing
7.5 Other Signal and Image Processing
Track 8. Hardware Design
8.1 Processor and Memory Design
8.2 MEMS/NEMS
8.3 Nano-Electronics and Technology
8.4 Optics and Photonics
8.5 Power Management, Power Harvesting and Power
Electronics
8.6 Photovoltaic Devices/Panels and Energy Harvesting
8.7 Other Hardware Design
Track 9. Artificial Intelligence (AI)
and Internet of Things (IoT)
9.1 AI digital, analog cores and Deep Learning
9.2 Sensors, connectivity and systems
9.3 Embedded processors and controllers
9.4 Quantum computing
9.5 Neural Networks and Fuzzy Logic
9.6 Energy Harvesting and power management
9.7 Other AI and IoT
Track 10. Hardware Security
10.1 Hardware and System Authentication
10.2 Physically Unclonable Functions (PUFs)
10.3 Watermarking
10.4 Obfuscation and Logic-locking
10.5 Trojan Detection/Mitigation
10.6 Side Channel Leakage/Resistance
10.7 Embedded Cyber Physical Security
10.8 Other Security-Hardware/Software
Track 11. Smart Power
11.1 Smart Power Management for High-Performance
Cloud and AI Data Centers
11.2 Low Power Design techniques for IoT applications
11.3 Fully Integrated Voltage Regulators
11.4 Renewable Energy Systems, Wireless Charging and
11.5 Energy Harvesting
11.6 Smart Grid for Cloud Computing
11.7 Other Smart Power
Prospective authors are invited to submit a full paper (4 pages) describing original work. Only electronic submissions will be accepted. Papers should include title, abstract, and topic category from the list above in standard IEEE two column format for consideration as lecture or poster. Both formats have the same value, and the presentation method will be chosen for suitability. All submissions should be made electronically through the MWSCAS 2020 web site (http://www.mwscas2020.org). Students are encouraged to participate in the best student paper award contest. Accepted papers will be published in the conference proceedings subject to advance registration of at least one of the authors.
We are now the North American Flagship conference of the IEEE Circuits and Systems Society (CASS).
On behalf of the organizing committee for the 63rd IEEE International Midwest Symposium on Circuits and Systems we are pleased to invite you to MWSCAS 2020 to be held at the Springfield Sheraton hotel in Springfield Massachusetts, August 9th – 12th 2020. MWSCAS is the oldest Circuits and Systems Symposium sponsored by IEEE and is now the IEEE Circuits and Systems Society North American flagship conference.
Our conference theme this year is Electrical and Computer Engineering: The Future is What We Do! With focus on the Internet of Things (IoT) and Artificial Intelligence. MWSCAS 2020 will include oral and poster sessions, student paper contest, tutorials given by experts in circuits and systems, and special sessions. Conference session topics include all areas of electronic circuits and systems covering the latest innovations. There are eleven tracks – Analog Circuits and Systems, Digital Circuits and Systems, Communications Circuits and Systems, RF and Wireless Circuits and Systems, Sensor Circuits and Systems, Converter Circuits and Systems, Signal and Image Processing, Hardware Design, Artificial Intelligence (AI) and Internet of Things (IoT), Hardware Security, Smart Power. Each track has multiple sessions, details are provided in the Call for Papers.
Tutorials will be available on Sunday August 9th to provide an opportunity to quickly get up to speed in specific areas of circuits and systems appropriate for both experts and those new to the field.
Springfield, the 3rd largest City in Massachusetts and the 4th largest in all of New England, is a City of many attributes. It has been known as the “City of Firsts” – a moniker earned through a history of innovation, including America’s first Armory and military arsenal, the first American made automobile and the first radio station, to list just a few. Springfield may be best known for two other innovations – the birthplace of basketball and of Theodor Geisel, better known as “Dr. Seuss”. It is also home to several institutions of higher learning, including Western New England University — a university that is much more than its educational offerings. With a strategic plan of Individual Focus, Global Perspectives, the university’s focus on a personal approach to education sets the road map as it moves into a new decade of the 21st century, having celebrated its centennial year in 2019.
Downtown Springfield lies on the bank of the Connecticut River. The conference hotel is conveniently located in the heart of the city’s downtown, just minutes away the area’s top restaurants, entertainment and attractions. It is in close proximity to the following attractions
MGM Springfield Resort & Casino, Main Street with Restaurants, Retail Shopping, Movie Theater and Bowling Alley
Naismith Memorial Basketball Hall of Fame
The Springfield Museums lies on a quadrangle walkable from the meeting property. The five museums cover Science, History, Art, and the Amazing World of Dr. Seuss. Just down the block you can also check out the Springfield Armory.
Just ten minutes away is Six Flags New England, an amusement park for the whole family to enjoy!
Conference Committee
General Co-Chairs:
Neeraj Magotra
Western New England University
Springfield, MA, USA
Antonio E. de la Serna
DARPA Consultant, MBO Partners
Arlington, VA, USA
Technical Program
Co-Chairs:
Robert Brennan
ON Semiconductor
Waterloo, Canada
Kourosh Rahnamai
Western New England University
Springfield, MA, USA
Valencia Koomson
Tufts University
Medford, MA, USA
Special Sessions Co-Chairs:
Carla Purdy
University of Cincinnati
Cincinnati, OH ,USA
Amer Qouneh
Western New England University
Springfield, MA, USA
Publication Co-Chairs:
Stephen Adamshick
Western New England University
Springfield, MA, USA
Sameer Sonkusale
Tufts University
Medford, MA, USA
Tutorial Co-Chairs:
John Burke
Western New England University
Springfield, MA, USA
Igor Filanovsky
University of Alberta
Alberta, Canada
Student Paper Contest
Co-Chairs:
Ken Jenkins
Pennsylvania State University
University Park, PA, USA
Ruolin Zhou
University of Massachusetts
Dartmouth, MA, USA
Publicity Co-Chairs:
Angela Burke
Publicity Consultant
Westfiield, MA USA
Carla Purdy
University of Cincinnati
Cincinnati, OH ,USA
Finance Chair:
Robert Alongi
IEEE Boston Section
Boston, MA, USA

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