The 23rd Workshop on Synthesis And System Integration of Mixed Information Technologies

SASIMI 2021


  • URL: http://sasimi.jp/
  • Event Date: 2021-03-29 ~ 2021-03-30
  • Submission Date: 2020-10-23

Computer Hardware Design



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SASIMI 2021
THE 23rd WORKSHOP ON SYNTHESIS AND SYSTEM INTEGRATION
OF MIXED INFORMATION TECHNOLOGIES
March 29-30, 2021
Real-Time Virtual Workshop in JST
http://sasimi.jp/
Call for Papers
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Key Dates:
Submission due date October 23 (Fri), 2020
Notification of Acceptance December 26 (Sat), 2020
Final paper due date January 22 (Fri), 2021
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This workshop will provide an interchange forum on system design,
design experiences, EDA, and design methodologies for both of
industry and academy. Presentations on theoretical aspects, practical
issues, case studies and applications are encouraged. The workshop
gives an opportunity for presentation and discussion of advanced work
and research as an online real-time virtual workshop. Works in progress
and new ideas are also welcome. Special sessions for hot topics will be
provided. Proposals for the topics are welcome.
Areas of Interest include, but are not limited to:
* System Design, Design Experiences, and Industry Experiences
* Software/Hardware Design for Embedded Systems,
Cyber-Physical Systems, IoT, etc.
* Design for Manufacturability, Reliability, Security, etc.
* Behavioral/Logic/Layout Synthesis
* Test, Verification, and Simulation
* Analog and Mixed-Signal Design
* New Design Methodologies for Automobile, Bio, Environment,
Quantum, etc.
* Machine Learning, AI, and Brain-Inspired Computing.
Submission of Papers:
Prospective authors are invited to submit short papers of 2 pages,
or full papers* of 3 to 6 pages, electronically via the web site
below. Detailed instructions for paper submission will be available
at the web site. Official language is English.
* Best Paper Awards will be selected from full papers.
Questions should be directed to:
SASIMI 2021, c/o Prof. Yoshinori Takeuchi
Dept. of Electrical and Electronic Eng., School of Science and Engineering,
Kindai University, Higashi-Osaka, Japan
E-mail: sasimi21@sasimi.jp