EAI CloudComp 2023
Computer Networks & Wireless Communication Computer Security & Cryptography Engineering & Computer Science (General)
https://cloudcomp.eai-conferences.org/2023/
25-26, October 2023, Hong Kong, Hong Kong S.A.R.
Submission Deadline: 20 May, 2023 (AoE)
As a novel computing paradigm, cloud computing has changed the world tremendously in the past two decades. It offers scalable computing and storage resources as services to support various applications cost-effectively and flexibly. It has also promoted the proliferation of big data analytics and deep learning in the last decade. Currently, cloud computing is continuing to power and drive technological development and advances in various areas such as industrial manufacturing, medical healthcare, intelligent transportation, smart city, e-government, e-commerce, and e-finance, etc. It is also the backbone for emerging edge/fog computing technologies and Internet of Things (IoT) applications, which constitute a rapidly-evolving ecosystem that profoundly changes the world’s IT landscape and people’s lives.
CloudComp 2023 aims to bring together researchers and industry developers to discuss and share their recent viewpoints and contributions to cloud computing, It aims to present recent theories, experiences, and results obtained in a wide area relevant to computing, giving researchers and industrial practitioners an opportunity to gain in-depth insight on the current and futuristic cloud computing technologies.
All registered papers will be submitted for publishing by Springer and made available through Springer Link Digital Library.
Proceedings will be submitted for inclusion in leading indexing services, such as Web of Science, Compendex, Scopus, DBLP, EU Digital Library, IO-Port, MatchSciNet, Inspec and Zentralblatt MATH.
Authors of selected papers will be invited to submit an extended version to:
All accepted authors are eligible to submit an extended version in a fast track of:
Additional publication opportunities:
(Titles in this series are indexed in Ei Compendex, Web of Science & Scopus)
Papers should be submitted through EAI \Confy+' system and have to comply with the Springer format (see Author’s kit section).
Please note that regular papers should be 10-20 pages in length. This conference uses single-blind review model. Reviewers are anonymous to authors, names and affiliations of authors are shown to the Program Committee.
All conference papers undergo a thorough peer review process prior to the final decision and publication. This process is facilitated by experts in the Technical Program Committee during a dedicated conference period. Standard peer review is enhanced by EAI Community Review which allows EAI members to bid to review specific papers. All review assignments are ultimately decided by the responsible Technical Program Committee Members while the Technical Program Committee Chair is responsible for the final acceptance selection. You can learn more about Community Review here.
Full Paper Submission deadline
20 May 2023
Notification deadline
20 June 2023
Camera-ready deadline
15 September 2023
Start of Conference
25 October 2023
End of Conference
26 October 2023
General Chairs
- Wenjuan Li, The Hong Kong Polytechnic University, HK
Technical Program Committee Chairs
- Jiannong Cao, Hong Kong Polytechnic University, HK
- Weizhi Meng, Technical University of Denmark, DK
Technical Program Committee
https://cloudcomp.eai-conferences.org/2023/organizing-committee/