2021 the 2nd International Conference on Mechanical, Electronic and Robotics Engineering (MERE 2021)--Ei Compendex, Scopus

MERE--Ei, Scopus 2021


Microelectronics & Electronic Packaging



MERE 2021[Ei Compendex and Scopus]
★Full name: 2021 the 2nd International Conference on Mechanical, Electronic and Robotics Engineering (MERE 2021)--Ei Compendex, Scopus
★Short name: MERE 2021
★Time:November 25th-27th, 2021
★Place:Hong Kong
★Website:http://www.mere.org/
★Call for paper★
Topics are interested but not limited to:
- Mechanical Engineering
Acoustics and Noise Control
Manufacturing and Production Processes
Operations Management
Plasticity Mechanics
Production Technology
Transportation Challenges in Emerging Markets
Vehicle Design and Manufacturing
- Electronics Engineering
Circuits and Systems
Digital Circuits
Sensing and Sensor Networks
RF and Wireless Circuits'
Low Power Design and VLSI Physical Design
- Robotics Science and Engineering
Modeling and identification
Perception systems
Robot sensing and data fusion
Human centered systems
Mechanism design and applications
For details about topics, please visit at http://wwww.mere.org/cfp.html
★ Publication
All accepted papers of MERE 2021 will be collected into MERE 2021 Conference Proceedings, which is indexed by Ei Compendex, Scopus, etc.
★Submission★
1. Full paper(Publication and Presentation)
2. Abstract (Presentation Only )
Submission Online Electrical System: http://www.confsys.iconf.org/submission/mere2021
More detail about submission, please visit at http://www.mere.org/sub.html.
★★Conference Schedule★★
November 25th, 2021 | Registration & Conference Kits Collection
November 26th, 2021 | Opening Remarks & Keynote Speeches (Morning) & Parallel Sessions (Afternoon)
November 27th, 2021 | Social Program
★★Contact:
Allison Fung / Ms. (Conference Secretary)
Web: http://www.mere.org/
Email: mere_contact@robotics.ac.cn
Tel: +86-010-80699230 | +86-18010579209 | Mon-Fri 9:30-18:00