2021 International Conference on Electron Devices and Applications (ICEDA 2021)--SCOPUS, Ei Compendex

ICEDA--SCOPUS, Ei 2021


Microelectronics & Electronic Packaging



Full Name: 2021 International Conference on Electron Devices and Applications
Abbreviation: ICEDA 2021
2021 International Conference on Electron Devices and Applications (ICEDA 2021)--SCOPUS, Ei Compendex (CPX)
Web site: www.iceda.org
Conference Date: August 14-16, 2021
Conference Venue: Nanjing, China
Organized by: Southeast University, China
Speakers:
Prof. Juin J. Liou (IEEE Fellow), Shenzhen University, China
Prof. Xiaoqing Wen (IEEE Fellow), Kyushu Institute of Technology, Japan
Prof. Daohua Zhang, Nanyang Technological University, Singapore
~~More information about speakers, please visit: http://www.iceda.org/speaker.html
Conference Proceedings
Accepted and registered papers will be included in Conference Proceedings, which will be indexed by SCOPUS, Ei Compendex (CPX).
Submission:
You can submit your paper: https://easychair.org/conferences/?conf=iceda2021
For more details, you can learn through: http://www.iceda.org/sub.html
Call for Paper:
CMOS platform technologies
Logic device performance and circuit design challenges
Advanced process integration schemes and scaling approaches
Process module and process control advancements
Device technology co-optimization solutions
SiGe/Ge channel, GAA nanowire and stacked nanosheet
Stacked and monolithic 3D integration
BEOL compatible transistors
--Please check the following link which you can find more topics : http://www.iceda.org/cfp.html
Conference Venue:
Coming soon, more information, please visit : http://www.iceda.org/venue.html
Contact:
Conference Secretary: Ms. Ariel Xie
Email: icedaconf@vip.163.com
Tel: +86-13103333332 (English&Chinese)
Working Time: Monday - Friday 9:30-18:00 (UTC/GMT+08:00)