2022 2nd International Conference on Electron Devices and Applications (ICEDA 2022)

ICEDA 2022


Microelectronics & Electronic Packaging Power Engineering



 



Conference Proceedings

Accepted and registered papers will be included in Conference Proceedings, which will be indexed by SCOPUS, Ei Compendex (CPX).

>> ICEDA 2021 papers have been published in Journal of Physics: Conference Series (Volume 2065). 

>> Less than 1 month after online, the proceedings has been indexed by Ei Compendex and Scopus!



Keynote Speakers in 2022:

~Prof. Franco Maloberti, Univeristy of Pavia, Italy

Past President of IEEE Circuits and Systems Society, Life Fellow of IEEE



~Prof. Xianbin Wang, Western University, Canada

Fellow of Canadian Academy of Engineering, Fellow of Engineering Institute of Canada, Fellow of IEEE



~Prof. Massimo Alioto, National University of Singapore, Singapore

Editor in Chief of the IEEE Transactions on VLSI Systems, Fellow of IEEE



~Prof. Qiang Li, University of Electronic Science and Technology of China, China

Distinguished Lecturer of the IEEE Solid-State Circuits Society

Founding Chair of IEEE Chengdu SSCS/CASS Joint Chapter



Invited Speakers Information, please check: http://www.iceda.org/invited.html



Speakers in 2021:

Prof. Juin J. Liou (FIEEE), Shenzhen University, China

Prof. Xiaoqing Wen (FIEEE), Kyushu Institute of Technology, Japan

Prof. Daohua Zhang (FInstP, FIET), Nanyang Technological University, Singapore

Assoc. Prof. Jun Wu, Southeast University, China

Prof. Byung Seong Bae, Hoseo University, Korea

Prof. Razika ZAIR TALA-IGHIL, University M’hamed Bougara of Boumerdes, Algeria



More information about speakers, please visit: http://www.iceda.org/speaker.html



Submission:

You can submit your paper:https://easychair.org/conferences/?conf=iceda2022

For more details, you can learn through: http://www.iceda.org/sub.html



Call for Paper:

CMOS platform technologies

Logic device performance and circuit design challenges

Advanced process integration schemes and scaling approaches

Process module and process control advancements

Device technology co-optimization solutions

 SiGe/Ge channel, GAA nanowire and stacked nanosheet

Stacked and monolithic 3D integration

BEOL compatible transistors

--Please check the following link which you can find more topics : http://www.iceda.org/cfp.html



Contact:

Conference Secretary:Ms. Violet Xie

Email: icedaconf@vip.163.com

Tel: +86-13103333332 (English&Chinese)

Working Time: Monday - Friday 9:30-18:00 (UTC/GMT+08:00)