ICMSE-26
Materials Engineering Ceramic Engineering Engineering & Computer Science (General)
Topics of Interest for Submission include, but are Not Limited to:
This area covers the "why" behind material behavior at the atomic level.
Atomic Structure and Bonding:
Quantum mechanics of atoms.
Primary bonds (Ionic, Covalent, Metallic).
Secondary bonds (Van der Waals, Hydrogen bonding).
Crystallography and Crystal Structures:
Unit cells and Bravais lattices.
Miller indices (planes and directions).
Crystalline vs. Amorphous materials.
Polymorphism and Allotropy.
Imperfections in Solids:
Point defects (Vacancies, Interstitials, Schottky/Frenkel defects).
Line defects (Dislocations: Edge, Screw, and Mixed).
Interfacial defects (Grain boundaries, Twin boundaries).
Bulk or volume defects.
These topics govern how materials change over time and under different environmental conditions.
Thermodynamics of Materials:
Laws of thermodynamics applied to solids.
Phase equilibria and Gibbs Phase Rule.
Free energy-composition diagrams.
Phase Diagrams:
Unary and Binary systems.
Eutectic, Eutectoid, Peritectic, and Peritectoid reactions.
The Iron-Carbon system ($Fe-Fe_3C$).
Kinetics and Diffusion:
Fick’s First and Second Laws of Diffusion.
Mechanisms of diffusion (Vacancy vs. Interstitial).
Nucleation and growth kinetics.
TTT (Time-Temperature-Transformation) diagrams.
Materials are generally categorized based on their chemical makeup and physical properties.
Metals and Alloys:
Ferrous alloys (Steels and Cast irons).
Non-ferrous alloys (Aluminum, Titanium, Magnesium, Copper).
Superalloys for high-temperature applications.
Ceramics and Glasses:
Structure of ionic crystals.
Traditional vs. Advanced ceramics.
Glass transition temperature and silicate structures.
Polymers:
Molecular weight and Degree of polymerization.
Thermoplastics vs. Thermosets.
Crystallinity in polymers.
Elastomers.
Composites:
Particle-reinforced vs. Fiber-reinforced.
Matrix types (MMC, CMC, PMC).
Rule of Mixtures.
This describes how a material responds to external stimuli.
Mechanical Properties:
Stress-strain behavior (Elastic and Plastic deformation).
Hardness, Toughness, and Ductility.
Fracture mechanics (Brittle vs. Ductile).
Fatigue and Creep.
Electrical Properties:
Conductivity and Resistivity.
Energy band structures.
Semiconductors (Intrinsic vs. Extrinsic).
Dielectrics and Piezoelectricity.
Thermal Properties:
Heat capacity and Thermal expansion.
Thermal conductivity.
Thermal shock resistance.
Magnetic and Optical Properties:
Diamagnetism, Paramagnetism, Ferromagnetism.
Refraction, Reflection, and Absorption.
Photoluminescence and Lasers.
How we turn raw materials into useful shapes and components.
Metal Processing: Casting, Forging, Rolling, Extrusion, and Powder Metallurgy.
Polymer Processing: Injection molding, Blow molding, and 3D printing (Additive Manufacturing).
Ceramic Processing: Pressing, Slip casting, and Sintering.
Heat Treatment: Annealing, Quenching, Tempering, and Precipitation hardening.
Modern frontiers in MSE.
Nanomaterials: Carbon nanotubes, Graphene, and Quantum dots.
Biomaterials: Biocompatibility, Implants, and Tissue engineering.
Electronic/Optoelectronic Materials: Thin films and Photovoltaics.
Smart Materials: Shape memory alloys and Electroactive polymers.
Energy Materials: Battery electrodes, Fuel cells, and Supercapacitors.
The tools used to "see" and measure material attributes.
Microscopy: Optical, SEM (Scanning Electron), and TEM (Transmission Electron).
Diffraction: X-ray Diffraction (XRD).
Spectroscopy: XPS, EDX, and FTIR.
Thermal Analysis: DSC (Differential Scanning Calorimetry) and TGA (Thermogravimetric Analysis).