2025 The 10th International Conference on Integrated Circuits and Microsystems (ICICM 2025)
ICICM 2025
- URL: http://icicm.net/
- Event Date: 2025-10-17 ~ 2025-10-19
- Submission Date: 2025-09-01
- Location: Hefei, China
Engineering & Computer Science (General)
★Full name: IEEE--2025 The 10th International Conference on Integrated Circuits and Microsystems (ICICM 2025)
★Abbreviation: ICICM 2025
**Place: Hefei, China
**Time: October 17-19, 2025
**Website: http://icicm.net/
★Co-Sponsored by:
==Anhui University
==Southeast University
==University of Electronic Science and Technology of China
==Submission==
1. Full paper (publication and presentation)
2. Abstract (presentation only)
★ Electronic submission system: https://easychair.org/conferences/?conf=icicm2025
★ Email submission: icicm_conf@vip.163.com
More detail about submission, please visit at http://icicm.net/submission.html
=Publication=
The accepted and registered papers will be publication in Conference Proceedings, which will be indexed by EI Compendex, Scopus, etc.
***ICICM2016-2024 has been successfully indexed by EI Compendex and Scopus already!
***Selected papers will be recommended to JOURNAL OF ELECTRONICS & INFORMATION TECHNOLOGY (EI Compendex & ESCI indexing)
=Topics (include but not limit)=
Track 1: Electronic Design Automation (EDA)
• Progress of EDA algorithms
• EDA for emerging technologies
• Hardware-software co-design with EDA
• EDA in High Performance Computing (HPC)
• EDA in analog and mixed-signal design
Track 2: Integrated Circuit and System Design
• Digital, analog, mixed-signal IC and SOC design technology
• IC computer-aided design technology, DFM
• Modeling and simulation
Track 3: Semiconductor Devices and Circuits
• Components and circuits for wireless systems
• Low power, RF devices and circuits
• Silicon/Germanium Devices and Device Physics
• Compound semiconductor devices and circuits
Track 4: Process Technology and Manufacturing
• Silicon integrated circuits and manufacturing
• Interconnect, low-K, high-K and other process technologies
• Packaging and testing technology, equipment technology
For more topics, please visit at: http://icicm.net/call-for-papers.html
==Organizing Committee==
Advisory Chairs
Junfa Mao, Shenzhen University, China
Yue Hao, Xidian University, China
Conference Chairs
Zhigong Wang, Southeast University, China
Ning Xu, Wuhan University of Technology, China
Conference Co-Chairs
Yu Wang,Tsinghua University,China
Letian Huang, University of Electronic Science and Technology of China, China
Program Chairs
Jiliang Zhang, Hunan University, China
Ying Wang, Institute of Computing Technology, Chinese Academy of Sciences, China
Sheng Chang, Wuhan University, China
Yingmei Chen, Southeast University, China
Xiulong Wu, Anhui University, China
Zhikuang Cai, Nanjing University of Posts and Telecommunications, China
Zhuo Zou, Fudan University, China
Jianguo Hu, Sun Yat-sen University , China
Bei Yu,The Chinese University of Hong Kong, China
Program Co-Chairs
Junyong Deng, Xi'an University of Posts & Telecommunications, China
Jun Xu, Nanjing University, China
Zhixiong Di, Southwest Jiaotong University, China
Guojie Luo, Peking University, China
Xiaojun Zhai, University of Essex, UK
Wei Xing, The University of Sheffield, UK
Program Committee
Shi Pu, Wuhan University of Technology , China
Haizhi Song, University Of Electronic Science And Technology Of China, China
Lu Zhu, Sun Yat-sen University, China
Youming Zhang, Southeast University, China
Jianshi Tang, Tsinghua University, China
Weiguang Sheng, Shanghai Jiao Tong University, China
Hao Gao, Austria & Eindhoven University of Technology, The Netherland
Yun Fang, Silicon Austria Labs, Austria
Jeff Kilby, Auckland University of Technology, New Zealand
Zhijun Zhou, Southeast University, China
Xingyuan Tong, Xi`an University Of Posts & Telecommunications, China
Wei Hu, Northwestern Polytechnical University, China
Local Chair
Bowen Jia, Wuhan University of Technology , China
Student Program Chairs
Keping Wang, Tianjin University, China
Delong Shang, Institute of Microelectronics of the Chinese Academy of Sciences, China
Fanyi Meng, Tianjin University, China
Student Program Committee
Li Du, Nanjing University, China
Lei Wang, Nanjing University Of Posts And Telecommunications, China
Xianbo Li, Sun Yat-sen University, China
Tiehu Li, Chongqing University of Technology, China
Moufu Kong, University of Electronic Science and Technology of China, China
Jiaxin Liu, University of Electronic Science and Technology of China, China
Maliang Liu, Xidian University, China
More Organizing Committee list, please visit: https://icicm.net/committee.html
==History==
ICICM2016 | Chengdu on November 23-25, 2016
ICICM2017 | Nanjing on November 8-11, 2017
ICICM2018 | Shanghai on November 24-26, 2018
ICICM2019 | Beijing on October 25-27,2019
ICICM2020 | Nanjing on October 23-25, 2020
ICICM2021 | Nanjing on October 22-24, 2021
ICICM2022 | Xi'an on October 28-31, 2022
ICICM2023 | Nanjing on October 20-23, 2023
ICICM2024 | Wuhan on October 25-27, 2024
=Contact us=
Ms. Mila Xiao
Email: icicm_conf@vip.163.com
Web: http://icicm.net/
Tel: (86)134-0855-5552
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