2022 3rd International Conference on Electronics and Signal Processing (ICESP 2022)--EI Compendex, Scopus

ICESP--EI, Scopus 2022


Microelectronics & Electronic Packaging



Abbreviation: ICESP 2022
Full Name: 2022 3rd International Conference on Electronics and Signal Processing (ICESP 2022)--EI Compendex, Scopus
Venue: Hong Kong, China
Time: March 25-27, 2022
Web: http://www.icesp.org/
Publication:
Submissions will be peer reviewed by both the conference scientific committees and journal editorial board. All registered and presented papers will be published in ICESP Conference Proceedings, which will be submitted for *EI Compendex*, *Scopus* et al.
Submission Methods:
Electronic Submission System (.pdf)
http://confsys.iconf.org/conference/icesp2022
Agenda Overview:
March 25, 2022: Participants Onsite Registration & Conference Materials Collection
March 26, 2022: Conference Date
March 27, 2022: Academic Visiting/One day tour
Topics of Interest for Submission:
Ad-Hoc and Sensor Networks
Analog and Mixed Signal Processing
Audio/Speech Processing and Coding
Bioimaging and Signal Processing
Digital Signal Processing
Multimedia & Human-computer Interaction
Next Generation Mobile Communications
Signal Processing and Communications Education
Statistic Learning & Pattern Recognition
Video compression & Streaming
Watermarking and Information Hiding

More topics: http://www.icesp.org/cfp.html
Venue:
Dorsett Mongkok, Hong Kong
Add: 88 Tai Kok Tsui Road, Kowloon, Yau Tsim Mong District, Hong Kong, Hong Kong
Contacts:
Ms. Fiona
Email: icesp_conf@163.com
Phone: +86-13731111131
9:30am--12am, 2pm-5:30pm, Monday to Friday