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ESREF 2022
URL:
https://www.esref2022.org/
Event Date: 2022-09-28 ~ 2022-09-30
Submission Date: 2022-04-01
Location:
Dublin, Ireland
Microelectronics & Electronic Packaging
ESREF 2022, the 33th European Symposium on Relia-
bility of Electron Devices, Failure Physics and Analysis,
will take place in Berlin (Germany) from 26th to 29th
September 2022 at the H4 Hotel Berlin Alexander
-
platz. This international symposium continues to fo-
cus on recent developments and future perspectives
in Quality and Reliability Management of materials,
devices and circuits for micro-, nano-, and optoelec-
tronics. It provides a European forum for developing
all aspects of reliability management and innovative
analysis techniques for present and future electronic
applications. The conference provides attractive exhibi-
tion and sponsorship options.
SCOPE OF PAPERS
High quality abstracts are accepted for presentation
at ESREF and publication in Microelectronics Relia-
bility Journal.
They should contribute to reliabi-
lity concepts, the understanding and analysis
of failure mechanisms by means of innovative
methods in failure analysis, measurement, cha-
racterisation or modelling.
During submission the
authors will be asked to give their preferences with
regards one or more tracks as described below:
A - Assessment Techniques and Methods for Devices and Systems
B - Semiconductor and Nanoelectronics Technologies
C - Progress in Failure Analysis Methods
D - Microwave Devices and Circuits
E - Packaging and Assemblies
E1 – Wafer- and Panel-Level Interconnection Technologies
E2 – Second-Level Interconnects
F - Power Devices and Systems
F1 – Smart Power Devices, IGBT, Thyristors
F2 – Wide Bandgap Power Devices
F3 - Power Electronic Systems
G - Photonics Devices
H - MEMS and Sensors
I - Extreme Environments and Radiation
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MANUSCRIPT
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