ESREF 2022


Microelectronics & Electronic Packaging



ESREF 2022, the 33th European Symposium on Relia-

bility of Electron Devices, Failure Physics and Analysis,

will take place in Berlin (Germany) from 26th to 29th

September 2022 at the H4 Hotel Berlin Alexander -

platz. This international symposium continues to fo-

cus on recent developments and future perspectives

in Quality and Reliability Management of materials,

devices and circuits for micro-, nano-, and optoelec-

tronics. It provides a European forum for developing

all aspects of reliability management and innovative

analysis techniques for present and future electronic

applications. The conference provides attractive exhibi-

tion and sponsorship options.                                                                                                                                                          SCOPE OF PAPERS

High quality abstracts are accepted for presentation

at ESREF and publication in Microelectronics Relia-

bility Journal. They should contribute to reliabi-

lity concepts, the understanding and analysis

of failure mechanisms by means of innovative

methods in failure analysis, measurement, cha-

racterisation or modelling. During submission the

authors will be asked to give their preferences with

regards one or more tracks as described below:

  • A - Assessment Techniques and Methods for Devices and Systems

  • B - Semiconductor and Nanoelectronics Technologies

  • C - Progress in Failure Analysis Methods

  • D - Microwave Devices and Circuits

  • E - Packaging and Assemblies

    • E1 – Wafer- and Panel-Level Interconnection Technologies

    • E2 – Second-Level Interconnects



  • F - Power Devices and Systems

    • F1 – Smart Power Devices, IGBT, Thyristors

    • F2 – Wide Bandgap Power Devices

    • F3 - Power Electronic Systems



  • G - Photonics Devices

  • H - MEMS and Sensors

  • I - Extreme Environments and Radiation