IEEE 2025 7th International Conference on Electronic Engineering and Informatics (EEI 2025)
EEI 2025
- URL: https://ais.cn/u/FnYnAb
- Event Date: 2025-11-07 ~ 2025-11-09
- Submission Date: 2025-10-31
- Location: Yangzhou, China
Computer Networks & Wireless Communication Bioinformatics & Computational Biology
IEEE 2025 7th International Conference on Electronic Engineering and Informatics (EEI 2025) will be held in Yangzhou, China from November 7 to November 9, 2025.
Conference Website: https://ais.cn/u/FnYnAb
---Call For Papers---
The topics of interest for submission include, but are not limited to:
◕ Electronic Technology
3D process and integration technology
Substrate embedding and advanced flip chip packaging
MEMS and sensor technology
Design and Analysis of Transmission System
New materials, equipment and 3D interconnection
Wearable, flexible and stretchable electronics
Optical interconnection and 3D photonics
Digital system and logic design
Computer architecture and VLSI
Network-driven multi-core chip
Advanced robotic system
Analog and digital electronics
Signals and Systems
◕Information and Communication
Electronic equipment
Satellite and Space Communications
Network and Information Security
Signal processing for wireless communication
Cognitive Radio and Software Radio
Optical networks and systems
Electromagnetic field theory
Antenna, propagation and transmission technology
Optical communication
Radar signal and data processing
Other related topics
---Publication---
All papers, both invited and contributed, the accepted papers, will be published and submitted for inclusion into IEEE Xplore subject to meeting IEEE Xplore’s scope and quality requirements, and also submitted to EI Compendex and Scopus for indexing. All conference proceedings paper can not be less than 4 pages.
---Important Dates---
Full Paper Submission Date: October 8, 2025
Registration Deadline: October 31, 2025
Final Paper Submission Date: October 31, 2025
Conference Dates: November 7-9, 2025
--- Paper Submission---
Please send the full paper(word+pdf) to Submission System:
https://ais.cn/u/FnYnAb
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