Call For Papers - The World's Largest Index/List of Call For Papers

CICMT 2022

URL: https://www.conftool.net/cicmt2022/
Event Date: 2022-07-13 ~ 2022-07-15
Submission Date: 2022-03-18
Organizer: IMAPS
Location: Vienna, Austria

The Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) conference brings

together a diverse set of disciplines to share experiences and promote opportunities to accelerate

research, development and the application of ceramic interconnect and ceramic microsystems

technologies. This international conference features ceramic technology for both microsystems

and interconnect applications in a multi-track technical program. The Ceramic Interconnect track

focuses on cost-effective and reliable high-performance ceramic interconnect products for extreme

environments in the automotive, aerospace, lighting, solar, and communication industries.

The Ceramic Microsystems track focuses on emerging applications and new products that exploit

the ability of 3D ceramic structures to integrate interconnect/packaging with microfluidic, optical,

micro-reactor and sensing functions. Multilayer ceramic, thin film, tape casting, thick film hybrid,

direct write, and rapid prototyping technologies are common to both tracks, with emphasis on

materials, processes, prototype development, advanced design, and application opportunities.

Planned sessions and paper topics include:

1. Functional materials for passive/active

devices and their properties

• Microwave/mm-wave LTCC/ULTCC dielectric

materials

• Ferroelectric/piezoelectric/pyroelectric/ferrite/

multiferroic materials

• Sensitive ceramics/thermoelectric/electrocaloric

materials

• Dielectric/ferroelectric/piezoelectric composites

• Pastes/inks/slurries for electronics

2. Material processing and device manufacturing

technologies

• LTCC/HTCC and multilayer ceramic and glass

processing

• Emerging ultralow temperature, room

temperature processing, and cold sintering

processing

• Additive manufacturing /3D printing/ direct

writing

• Advanced thick film processing

• Fine structuring technologies

• Emerging embedding/integration technologies

3. Design, modeling, simulation, characterization

and reliability

• Metamaterials design, realization and

characterization

• High frequency devices design/modeling/

simulation

• Materials and devices characterization

• Material and device reliability, lifetime, and

failure estimation

• Thermal management/thermal transfer

simulation

4. Devices and systems for emerging applications

• Circuits, antennas, and filters for MHz, GHz and

THz for communications

• Automotive/aerospace/medical electronics/

optoelectronics

• Flexible/wearable electronics

• Integrated physical/chemical/biological

sensors and actuators

• Packaging and integration issues for MEMS

and BioMEMS devices

• Batteries/fuel cells/ energy conversion systems

• Micro-reactors/micro-fluidic devices

Please submit your 500+ word abstract electronically by March 18, 2022 using the online system at

https://www.conftool.net/cicmt2022/

Full papers are due by May 15, 2022 and should be uploaded separately after it has been determined

whether the abstract has been accepted. All papers will be presented and published in

English. If you have problems with the online system, please email the conference office:

cicmt2022@mcc-events.de.

Event Promotion

2024-06-02 ~ 2024-06-06

2024-08-19 ~ 2024-08-22

CICMT 2022

Event Promotion

Journal Promotion