ICECC 2022
→Publication
Accepted papers of ICECC 2022 (after proper registration and presentation) will be collected in the conference proceedings, which will be submitted for indexing in Ei Compendex, Scopus, etc.
→Topics
3D Process and Integration Technologies
Substrate Embedding & Advanced Flip-Chip Packaging
MEMS & Sensor Technologies
Wafer-Level CSP & Heterogeneous Integration
Design and Analysis of Power Delivery Systems
Novel Materials, Devices and 3D Interconnects
Wearable, Flexible, and Stretchable Electronics
Optical Interconnects & 3D Photonics
Digital System and Logic Design
Computer Architecture and VLSI
Networked-Driven Multicore Chips
Advance Robotics Systems
Electrical Machines
Analog and Digital Electronics
Signals and Systems
For more topics, please check:http://www.icecc.org/cfp.html
→Submission Guideline
1. Submission Requirements
♦ Language
English is the official language of the conference. The paper should be written and presented only in English.
♦ Publication & Presentation
Full paper (at least 8 pages) submission is required if you consider publishing your paper.
♦ Presentation Only
Abstract (200-400 words) submission is acceptable for presentation only at ICECC 2022.
♦Paper Length
Each paper should have 8 pages at least. A regular registration can cover a paper within 10 pages and more pages will be charged at 60 USD/page. Please well format your paper according to the template before submission.
♦How to submit?
Send to official email directly: icecc@iacsit.net. or submit via Online submission system: http://confsys.iconf.org/submission/icecc2022
→Contact
Conference secretary: Ms. Reina Wang
Email: icecc@iacsit.net
Tel: +86-18302820449
Office Hour: 9:30-18:00
Monday to Friday (GMT+8)