24th BARCELONA World Conference on Advances in Electrical, Electronics, and Computing Systems (AE2CS-26) April 20-22, 2026 Barcelona (Spain)
AE2CS-26
- URL: https://eaceee.erpub.org/conference/185
- Event Date: 2026-04-20 ~ 2026-04-22
- Submission Date: 2026-04-01
- Organizer: EACEEE
- Location: Barcelona, Spain
Electrochemistry Computational Linguistics Computer Graphics Computer Hardware Design Computer Networks & Wireless Communication
Topics of Interest for Submission include, but are Not Limited to:
1. Electrical Engineering: Power & Energy Systems
As the global energy landscape shifts toward decentralization, research is focusing on the "Smart Grid" and the integration of intermittent renewables.
Smart Grid & Microgrid Technologies
Subtopics: Self-healing grid architectures, DC microgrids for residential buildings, and peer-to-peer (P2P) energy trading using Blockchain.
Renewable Energy Integration
Subtopics: Bifacial solar panel optimization, Concentrated Solar Power (CSP) with thermal storage, and green hydrogen production via high-efficiency electrolyzers.
Electric Vehicle (EV) Infrastructure
Subtopics: Bidirectional charging (Vehicle-to-Grid/V2G), ultra-fast wireless charging systems, and AI-based battery health management.
Advanced Power Electronics
Subtopics: Wide-bandgap (WBG) semiconductors like Gallium Nitride (GaN) and Silicon Carbide (SiC) for high-efficiency converters.
2. Electronics & VLSI Systems
The "More than Moore" era is driving innovation in how chips are packaged and the materials used to build them.
Next-Gen Semiconductor Materials
Subtopics: Graphene and transition metal dichalcogenides (TMDs) for sub-2nm nodes, and organic electronics for flexible, biodegradable devices.
Advanced IC Packaging
Subtopics: Heterogeneous integration (Chiplets), 3D-IC stacking using Through-Silicon Vias (TSVs), and Fan-Out Wafer-Level Packaging (FOWLP).
Hardware for AI (Edge & Cloud)
Subtopics: Neuromorphic chips that mimic brain architecture, Tensor Processing Units (TPUs), and In-Memory Computing (IMC) to reduce data movement latency.
Hardware Security & Trust
Subtopics: Physically Unclonable Functions (PUFs), detection of Hardware Trojans, and side-channel attack mitigation.
3. Computing Systems & AI
Computing is moving away from purely centralized models toward distributed, privacy-preserving, and "agentic" systems.
Edge Computing & IoT
Subtopics: Low-latency 6G edge intelligence, Swarm Robotics coordination, and energy-harvesting sensors for massive IoT deployments.
Advanced AI Paradigms
Subtopics: Explainable AI (XAI) for transparency in healthcare/finance, Federated Learning for decentralized training without sharing private data, and Agentic AI (autonomous agents capable of multi-step reasoning).
Quantum Computing
Subtopics: Quantum error correction, Hybrid Quantum-Classical algorithms (QAOA, VQE), and Quantum Key Distribution (QKD) for post-quantum cryptography.
Cybersecurity & Resilience
Subtopics: Zero Trust Architecture (ZTA), AI-powered real-time threat detection, and Secure Multiparty Computation (SMPC).
4. Communication & Signal Processing
The transition from 5G to 6G is introducing frequencies and speeds that require entirely new signal processing techniques.
Future Wireless Networks (B5G/6G)
Subtopics: Terahertz (THz) communication, Reconfigurable Intelligent Surfaces (RIS), and Integrated Sensing and Communication (ISAC).
Satellite & Space Communications
Subtopics: Low Earth Orbit (LEO) satellite constellations (Starlink/Kuiper), and optical/laser communication for inter-satellite links.
Advanced Signal Processing
Subtopics: Deep Learning-based physical layer optimization, MIMO beamforming using AI, and compressed sensing for high-resolution imaging.
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