Workshop on Recent Advances in Biometrics and its Applications | 2019 42th Int. Conference on Telecommunications and Signal Processing (TSP) | IEEE R8 | IEEE Xplore® | SCOPUS
Biometrics - TSP 2019
- URL: http://tsp.vutbr.cz/?page_id=2744#WS1-19
- Event Date: 2019-07-01 ~ 2019-07-03
- Submission Date: 2019-02-15
- Location: Budapest, Hungary
Computer Graphics Computer Vision & Pattern Recognition
The 3rd International Workshop on Recent Advances in Biometrics and its Applications
July 1-3, 2019, Budapest, Hungary
CFP: http://tsp.vutbr.cz/documents/TSP2019_CfP_WS1-v1.pdf
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Biometric recognition has become a burgeoning research area due to the industrial and government needs for security and privacy concerns. It has also become center of focus for many authentication and identification applications in the civil and forensic fields. Within the framework of the 2019 42nd International Conference on Telecommunications and Signal Processing (TSP) held during July 1-3, 2019 in Budapest, Hungary, we invite you to the 3rd International Workshop on Recent Advances in Biometrics and its Applications. The goal of this workshop is to present and discuss the recent fundamental and applied research works providing novel solutions to challenging problems in biometrics. It is an opportunity to bring researchers and experts together to discuss the current and future state of biometrics and possible areas of further cooperation.
Topics of interest include, but are not limited to, the following:
- Biometrics based authentication and identification
- Physiological and behavioral biometrics
- Biometric feature extraction and matching
- Signal, image and video processing in biometrics
- Machine learning in biometrics
- Fusion techniques in biometrics
- Soft biometrics
- Multimodal biometrics
- Biometric security and privacy
- Big data challenges in biometrics
- Related applications
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Important Dates
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Paper Submission Deadline: February 15, 2019
Notification of Acceptance: April 15, 2019
Authors' Registration: May 20, 2019
Conference/workshop: July 1-3, 2019
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Proceedings
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All accepted papers will be published in the TSP 2019 Conference Proceedings issued online. The Proceedings with presented papers will be submitted for indexing in IEEE Xplore® Digital Library - IEEE Conference Record #46676, Conference Proceedings Citation Index (CPCI) of Thomson Reuters, SCOPUS, DBLP, and Google Scholar databases.
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Special Journal Issue
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Selected high-quality papers will be invited for publication in Special Issue “Recent Advances in Biometrics and its Applications” in Electronics journal (SJR Q1, IF: 2.11).
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Editorial Board
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Assoc. Prof. Dr. Larbi Boubchir — LIASD - University of Paris 8, France (Editor-in-Chief, larbi.boubchir@ai.univ-paris8.fr)
Prof. Boubaker Daachi — LIASD - University of Paris 8, France (bd@ai.univ-paris8.fr)
Journal Promotion
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| Acta Koreana (Acta Koreana) |
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| Acta Via Serica (AVS) |
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| Computers and Concrete (CAC) |
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| Journal of Information Processing Systems (JIPS) |
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| Journal of Internet Computing and Services (KSII - JICS) |
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| Journal of Smart Tourism (Smart Tourism) |
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| Membrane and Water Treatment (MWT) |
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| Wind and Structures, An International Journal (Wind and Structures) |
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