CCE 2019
CCE 2019
- URL: http://cce.cinvestav.mx/
- Event Date: 2019-09-11 ~ 2019-09-13
- Submission Date: 2019-06-03
- Location: Mexico, Philippines
Microelectronics & Electronic Packaging
Submitted manuscripts should be six (6) pages or tour (4) pages in EEE tow-column format, including figures, tables, and references.
Registration fee: $250.00 US Dollar.Students or IEEE members: $150.00 US Dollar.
Journal Promotion
|
| Acta Koreana (Acta Koreana) |
|
| Acta Via Serica (AVS) |
|
| Computers and Concrete (CAC) |
|
| Journal of Information Processing Systems (JIPS) |
|
| Journal of Internet Computing and Services (KSII - JICS) |
|
| Journal of Smart Tourism (Smart Tourism) |
|
| Membrane and Water Treatment (MWT) |
|
| Wind and Structures, An International Journal (Wind and Structures) |
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