2019 The 4th International Conference on Electronics Engineering and Informatics (ICEEI 2019)--EI Compendex, Scopus
ICEEI--EI, Scopus 2019
- URL: http://www.iceei.org/
- Event Date: 2019-06-15 ~ 2019-06-17
- Submission Date: 2019-01-25
Microelectronics & Electronic Packaging Electromagnetism
2019 The 4th International Conference on Electronics Engineering and Informatics (ICEEI 2019) will be held from the 15th to the 17th of June 2019 in Hong Kong.
This conference is organized by Science and Engineering Institute, co organized by Bauman Moscow State technical University, Russia, Tokyo University of Science, Japan and China Agricultural University
Publication and Indexing: As the workshop of WCSE, submissions of ICEEI 2019 will be peer reviewed. Accepted and registered papers will be published in proceedings, which will be indexed by Ei and Scopus. The conference has been running for three consecutive years and was successfully searched by EI, scopus about three months after the meeting.
ICEEI 2018 | Bangkok, Thailand, June 28-30, 2018 | Proceedings 2018, ISBN: 978-981-11-7861-0
ICEEI 2017 | Beijing, China, June 25-27, 2017 | Proceedings 2017, ISBN: 978-981-11-3671-9
ICEEI 2016 | Tokyo, Japan, June 17-19, 2016 | Proceedings 2016, ISBN: 978-981-11-0008-6
More please view: http://www.iceei.org/
Submission ways:
Send the Full paper & Abstract to submission System: http://confsys.iconf.org/submission/iceei2019
Keynote Speaker
Prof. Hong Lin, University of Houston-Downtown, USA
Prof. Heng Chen, Chinese Academy of Sciences, China
Prof. Hiroaki Fukuda, Shibaura Institute of Technology, Tokyo, Japan
Prof. Li Wenyuan, Southeast University, China
Call for Papers:
Electronics and Communications Engineering
Applied Electronics
Microwave Engineering
Coding and Signal Processing
Informatic and Communication Engineering
For more topics,please visit: http://iceei.org/cfp.html
Program
June 15, 2019--Registration, collecting conference materials; Workshops-pending;
June 16, 2019--Opening Remarks & Keynote Speeches, Oral & Poster Sessions;
June 17, 2019--Academic Visit/ City Visit (Pending)
Venue(Pending)
Grand Hyatt Hong Kong
Add:1 Harbour Road, Wan Chai, Hong Kong, Hong Kong
Conference secretary:
Ms. Amber Lin. iceei@zhconf.ac.cn
Tel: +86-28-8652-8629
Submission: Before January 25, 2019
Journal Promotion
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| Acta Koreana (Acta Koreana) |
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| Acta Via Serica (AVS) |
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| Computers and Concrete (CAC) |
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| Journal of Information Processing Systems (JIPS) |
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| Journal of Internet Computing and Services (KSII - JICS) |
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| Journal of Smart Tourism (Smart Tourism) |
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| Membrane and Water Treatment (MWT) |
|
| Wind and Structures, An International Journal (Wind and Structures) |
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