4th International Conference on Design Engineering and Product Innovation (ICDEPI 2020)
EI-ICDEPI 2020
- URL: http://www.icdepi.org/
- Event Date: 2020-07-09 ~ 2020-07-11
- Submission Date: 2019-12-30
Call for Papers
4th International Conference on Design Engineering and Product Innovation (ICDEPI 2020)
9-11, July, 2020/Kuala Lumpur, Malaysia
Web: http://www.icdepi.org/
4th International Conference on Design Engineering and Product Innovation (ICDEPI 2020) is co-organized by Nazarbayev University and Hong Kong Society of Mechanical Engineers (HKSME). The conference will be held at Kuala Lumpur, Malaysia from July 9 to 11, 2020!
The conference is an international forum for the presentation of technological advances and research results in the fields of design engineering and product innovation.
●Publication Information
All papers of ICDEPI 2020 will be published in Conference Proceeding , which will be indexed by EI Compendex, Scopus, Conference Proceedings Citation Index – Science (CPCI-S)(Thomson Reuters, Web of Science), Inspec and other indexing organizations.
●Topics(for more topics: http://www.icdepi.org/cfp.html)
Design Engineering
Design Processes
Design Theory and Research Methodology
Design Education
Production Innovation
Product Development and Design
Product Process Design and Management
Product Quality Management
●Paper Submission
Submission Email: icdepi@smehk.org
Submission System: https://cmt3.research.microsoft.com/ICDEPI
●Call for participants
1,Presenter:If you are interested in giving presentation on conference, without publishing your paper in the proceeding, you need to submit the abstract and title of your presentation to us: icdepi@smehk.org
2,Listener: If you are interested in attending the conference to participant this gathering on the field of Design Engineering and Product Innovation you are welcome to join us and share your ideas!
3,Reviewer:Experts in the area of Design Engineering and Product Innovation are welcome to join the conference as reviewer. Send your CV to: icdepi@smehk.org
●Contact Us
Ms. Linda Lee
Email: icdepi@smehk.org
Tel:+852-30697937( Hong Kong)
Web: http://www.icdepi.org/
4th International Conference on Design Engineering and Product Innovation (ICDEPI 2020)
9-11, July, 2020/Kuala Lumpur, Malaysia
Web: http://www.icdepi.org/
4th International Conference on Design Engineering and Product Innovation (ICDEPI 2020) is co-organized by Nazarbayev University and Hong Kong Society of Mechanical Engineers (HKSME). The conference will be held at Kuala Lumpur, Malaysia from July 9 to 11, 2020!
The conference is an international forum for the presentation of technological advances and research results in the fields of design engineering and product innovation.
●Publication Information
All papers of ICDEPI 2020 will be published in Conference Proceeding , which will be indexed by EI Compendex, Scopus, Conference Proceedings Citation Index – Science (CPCI-S)(Thomson Reuters, Web of Science), Inspec and other indexing organizations.
●Topics(for more topics: http://www.icdepi.org/cfp.html)
Design Engineering
Design Processes
Design Theory and Research Methodology
Design Education
Production Innovation
Product Development and Design
Product Process Design and Management
Product Quality Management
●Paper Submission
Submission Email: icdepi@smehk.org
Submission System: https://cmt3.research.microsoft.com/ICDEPI
●Call for participants
1,Presenter:If you are interested in giving presentation on conference, without publishing your paper in the proceeding, you need to submit the abstract and title of your presentation to us: icdepi@smehk.org
2,Listener: If you are interested in attending the conference to participant this gathering on the field of Design Engineering and Product Innovation you are welcome to join us and share your ideas!
3,Reviewer:Experts in the area of Design Engineering and Product Innovation are welcome to join the conference as reviewer. Send your CV to: icdepi@smehk.org
●Contact Us
Ms. Linda Lee
Email: icdepi@smehk.org
Tel:+852-30697937( Hong Kong)
Web: http://www.icdepi.org/
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