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International Conference on Omni-Layer Intelligent Systems

COINS 2019

URL: http://coinsconf.com/
Event Date: 2019-05-05 ~ 2019-05-07
Submission Date: 2018-12-01

Data Mining & Analysis Databases & Information Systems

In Cooperation with: IEEE Council on Electronic Design Automation (IEEE CEDA)
Proceedings: ACM
Best papers: will be published in Elsevier journal “Microprocessors and Microsystems: Embedded Hardware Design” (MICPRO)
Student Grants: registration grants for highly skilled students
Scope:
The Intelligent Internet of Things (IoT) tsunami is affecting every aspect of life, ranging from smart cars, smart homes, smart cities, smart factories to smart health, and smart environments. Although IoT vastly expanded the possibilities to fulfill many of our needs, numerous challenges still should to be addressed in order to develop smart, consistent, suitable, safe, flexible and power-efficient systems. To enable this transformation and to better understand the untapped opportunities, the interdisciplinary landscape of IoT demands a large number of significant technological advancements in the hardware and software communities to come together and to synergize their efforts. COINS (International Conference on Omni-layer Intelligent systems) focuses on novel omni-layer techniques for smart IoT systems, by identifying new perspectives and highlighting impending research issues and challenges. In particular, this conference addresses all-important aspects of novel IoT technologies from Connected Devices, to Edge/Fog, Cloud, and application, covering manufacturing, materials, CMOS and beyond-CMOS devices, architecture, embedded systems, reconfigurable hardware, network, cloud, Omni-layer artificial intelligence and machine learning, big data, emerging applications, as well as human-machine interaction. COINS also discusses the associated challenges that need to be overcome for achieving the goal of accuracy, privacy, reliability and security.
COINS main topics include the following but are not limited to:
Track 1: Internet of Things: From Device, to Edge, and Cloud
Track 2: Omni-Layer Security, Privacy, and Trust
Track 3: Omni-layer Reliability in IoT Era
Track 4: VLSI, EDA, Embedded Systems, and Computer Architecture
Track 5: Real-time Systems
Track 6: Alternative and Approximate Computing
Track 7: Cloud Computing
Track 8: Programming Language and Software Engineering
Track 9: Big Data
Track 10: Artificial Intelligence, Machine Learning, Cognitive Computing, and Advanced Analytics
Track 11: Evolutionary Computer Vision, Image Processing and Pattern Recognition
Track 12: Automation Systems
Track 13: Automotive Systems
Track 14: Intelligent IoT eHealth
Track 15: Enterprise Architecture
COINS is sponsored by IEEE Council on Electronic Design Automation (CEDA). Moreover, the proceeding will be published in ACM. Accepted papers are allowed six pages in the conference proceedings free of charge. Each additional page beyond six pages is subject to the page charge at 150 Euro per page up to the eight-page limit. ACM will hold the copyright for COINS proceedings. Authors of accepted papers must sign an ACM copyright release form for their paper.
Extended versions of selected best papers will be published in a special issue of the ISI indexed Elsevier journal “Microprocessors and Microsystems: Embedded Hardware Design” (MICPRO) having the 2016 Impact Factor as high as 1.025
COINS Executive Committee is pleased to announce registration grants for highly skilled students who have an accepted paper. The number of grants is limited, therefore the funding is awarded on a competition basis. We are especially looking forward to applications from the Middle East and Asia.
Conference Board:
Prof. Krishnendu Chakrabarty, Duke University, USA
Prof. Jan M. Rabaey, UC Berkeley, USA
Prof. David Z. Pan, University of Texas at Austin, USA
Prof. Majid Sarrafzadeh, UCLA, USA
Dr.-Ing. Farshad Firouzi, mVISE AG, Germany
General Chairs:
Dr.-Ing. Farshad Firouzi, mVISE AG, Germany
Prof. Krishnendu Chakrabarty, Duke University, USA
Technical Chairs:
Dr. Bahar Farahani, Shahid Beheshti University, Iran
Dr. Fangming Ye, Huawei, USA
Dr. Vasilis Pavlidis, University of Manchester , UK
Local Chair:
Prof. Paris Kitsos, Technological Educational Institute of Western Greece, Greece
Publicity Chair:
Prof. Nicolas Sklavos, University of Patras, Hellas, Greece
Track Chairs:
Prof. Jörg Henkel, KIT, Germany
Prof. Akash Kumar, TU Dresden, Germany
Prof. Davide Brunelli, University of Trento, Italy
Prof. Kostas Siozios, Aristotle University of Thessaloniki, Greece
Prof. Matthias König, FH-Bielefeld University, Germany
Prof. Maria K. Michael, University of Cyprus, Cyprus
Prof. Jiang Li, Shanghai Jiaotong University, China
Prof. Luís Ferreira Pires, University of Twente, Netherlands
Prof. Federica Cena, Universita' di Torino, Italy
Prof. Mehrnoush Shamsfard, SBU, Iran
Prof. Pasi Liljeberg, University of Turku, Finland
Prof. Fereidoon Shams Aliee, SBU, Iran
Dr. Farzad Samie, KIT, Germany
All questions about submissions should be emailed to Dr.-Ing. Farshad Firouzi (farshadfirouzi@gmail.com).

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International Conference on Omni-Layer Intelligent Systems

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