The 7th Int'l Conference on Advanced Metallic Materials(AMM 2026)


Materials Engineering Chemical & Material Sciences (General) Composite Materials Materials Engineering Metallurgy



The 7th Int'l Conference on Advanced Metallic Materials(AMM 2026)



 August 7-9, 2026   Kunming, China



Websitehttps://www.academicx.org/AMM/2026/



DateAugust 7-9, 2026



VenueKunming, China



Email:contact8@academicx.org (wsaugust@126.com)



Index: CNKI, Google Scholar



? Conference Background



AAM 2026 is a significant platform that unites leading researchers and industry experts from around the world in the fields of Advanced Metallic Materials. This event offers a unique opportunity for scientific researchers, industry professionals, faculty members, and students from educational institutions to engage in meaningful communication and collaboration.  



 



 



Dr. Chunfu Chen

Zhejiang University Shaoxing Institute, China



Prof. Lee D. Wilson

University of Saskatchewan, Canada



Dr. Jian Wang

DWI-Leibniz Institute for Interactive Materials, Germany

Title: Ultrasound‑Driven Mechanically Responsive Polymer Systems



Dr. Zia ur Rehman

University of Karachi, Pakistan



Prof. Guangping Zheng

The Hong Kong Polytechnic University, China



Prof. Arnaud Caron

Herbert Gleiter International Institute of the Liaoning Academy of Materials (LAM-HGII), China

Title: AFM indentation and scratch testing across the microstructural scales



Dr. Aman Gupta

Sunchon National University, Republic of Korea



Prof. Pankaj Kaushik

Indian Institute of Information Technology, India



Prof. ElSayed AHMED AHMED ELNASHAR

Kaferelsheikh University, Egypt



 



? Call For Papers

The 7th International Conference on Advanced Metallic Materials (AAM 2026) will be held from August 7-9, 2026 in Kunming, China. You are invited to submit papers and participate in our academic exchange. 



 



The conference is soliciting state-of-the-art research papers in the following areas of interest:



 



Fundamental Phenomena & Theory



Phase Transformations & Microstructural Evolution



Defect Engineering



Deformation Mechanisms



Computational Materials Design



High-Entropy Alloys (HEAs) & Complex Concentrated Alloys (CCAs)



 



Advanced Processing & Manufacturing



Additive Manufacturing (3D Printing) of Metals



Severe Plastic Deformation (SPD)



Advanced Powder Metallurgy



Smart and Hybrid Processing



Surface Engineering & Coatings



 



Key Material Classes & Systems



Lightweight Alloys



High-Temperature Alloys



High-Performance Steels



Shape Memory and Superelastic Alloys



Metallic Glasses (Amorphous Metals)



Metal Matrix Composites (MMCs) and Nanocomposites



Functionally Graded Materials (FGMs)



 



Properties & Performance



Mechanical Behavior



Corrosion and Environmental Degradation



Fatigue and Fracture Mechanics



Functional Properties



Radiation-Resistant Materials



 



Sustainability & Life Cycle Engineering



Alloy Design for Recyclability



Green Manufacturing Processes



Materials for Energy Applications



Life Cycle Assessment (LCA) and Circular Economy



 



Characterization & Testing



Advanced Microscopy and Tomography



Non-Destructive Testing (NDT) and Evaluation



In-Situ and Operando Characterization



 



? Attendance Methods



1.Regular Attendance ( No Submission Required )



You're also welcome to attend our conference (without submitting full paper or abstract)



2.Abstract submission



Submit abstract ( Regular Attendance + Abstract + Presentation )



You are welcome to submit abstract for oral presentation or poster presentation.



3. Full Paper submission



Submit full paper ( Regular Attendance + Paper Publication + Presentation )



You are invited to submit papers and participate in our academic exchange. One author will be invited to make an oral presentation and the paper will be published by peer-reviewed open access journal.



? Contact Us



Email: contact8@academicx.org (wsaugust@126.com)



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Tel: +86 13296503784



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Wechat: 13296503784 / 3025797047



Official Account: Academic Communications