The 7th Int'l Conference on Biomedical Materials(ICBM 2026)


Materials Engineering Materials Engineering Biomedical Technology Biomedical Technology



The 7th Int'l Conference on Biomedical Materials(ICBM 2026)



 August 7-9, 2026   Kunming, China



Websitehttps://www.academicx.org/ICBM/2026/



DateAugust 7-9, 2026



VenueKunming, China



Email:contact8@academicx.org (wsaugust@126.com)



Index: CNKI, Google Scholar



 



? Conference Background



ICBM 2026 is a significant platform that unites leading researchers and industry experts from around the world in the fields of Biomedical Materials. This event offers a unique opportunity for scientific researchers, industry professionals, faculty members, and students from educational institutions to engage in meaningful communication and collaboration.  



 



Dr. Chunfu Chen

Zhejiang University Shaoxing Institute, China



Prof. Lee D. Wilson

University of Saskatchewan, Canada



Dr. Jian Wang

DWI-Leibniz Institute for Interactive Materials, Germany

Title: Ultrasound‑Driven Mechanically Responsive Polymer Systems



Dr. Zia ur Rehman

University of Karachi, Pakistan



Prof. Guangping Zheng

The Hong Kong Polytechnic University, China



Prof. Arnaud Caron

Herbert Gleiter International Institute of the Liaoning Academy of Materials (LAM-HGII), China

Title: AFM indentation and scratch testing across the microstructural scales



Dr. Aman Gupta

Sunchon National University, Republic of Korea



Prof. Pankaj Kaushik

Indian Institute of Information Technology, India



Prof. ElSayed AHMED AHMED ELNASHAR

Kaferelsheikh University, Egypt



 



? Call For Papers

The 7th Int'l Conference on Biomedical Materials (ICBM 2026) will be held from August 7-9, 2026 in Xiamen, China. You are invited to submit papers and participate in our academic exchange.



 



The conference is soliciting state-of-the-art research papers in the following areas of interest:



 



Biomaterials Design & Synthesis



Smart & Responsive Biomaterials



Bioinspired and Biomimetic Materials



Electroactive and Conductive Biomaterials



Peptide-based and Self-Assembling Materials



Decellularized Extracellular Matrix (dECM) Materials



 



Material Types & Systems



Advanced Polymeric Biomaterials



Metallic Biomaterials



Ceramic and Glass Biomaterials



Natural Biomaterials



Nanobiomaterials



Composite and Hybrid Biomaterials



 



Key Applications & Clinical Translation



Drug & Gene Delivery Systems:



Scaffold Design & Fabrication



Organ-on-a-Chip & In Vitro Models



Implants and Medical Devices:



Cardiovascular Implants



Orthopedic and Dental Implants



Neural Interfaces



Wound Healing & Dermatology



 



Biological Interactions & Performance



Biocompatibility and Biosafety



Host Response and Foreign Body Reaction



Mechanobiology



Antimicrobial and Antifouling Surfaces



Protein and Cell Interactions with Materials



 



Enabling Technologies & Characterization



3D Bioprinting & Biofabrication



Surface Modification and Functionalization



Advanced Characterization



In Vitro and In Vivo Testing Models



 



Regulatory, Commercialization & Translation



Translation from Lab to Clinic



Regulatory Science & Pathways



Clinical Trials



Commercialization and Market Trends



 



? Attendance Methods



1.Regular Attendance ( No Submission Required )



You're also welcome to attend our conference (without submitting full paper or abstract)



2.Abstract submission



Submit abstract ( Regular Attendance + Abstract + Presentation )



You are welcome to submit abstract for oral presentation or poster presentation.



3. Full Paper submission



Submit full paper ( Regular Attendance + Paper Publication + Presentation )



You are invited to submit papers and participate in our academic exchange. One author will be invited to make an oral presentation and the paper will be published by peer-reviewed open access journal.



? Contact Us



Email: contact8@academicx.org (wsaugust@126.com)



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Tel: +86 13296503784



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Official Account: Academic Communications