EMPC 2023

Microelectronics & Electronic Packaging

Welcome to EMPC 2023 in Cambridge!

The European Microelectronics Packaging Conference (EMPC 2023) is the premier international conference for microelectronics packaging, organised by IMAPS and IEEE-EPS. The conference program will focus on industrial needs and trends and on academic long-term solutions. The event brings together researchers, innovators, technologists, business and marketing managers with an interest in semiconductor packaging


Abstract Submission

The content must be original (previously unpublished), non-confidential and non-commercial. Maximum abstract length: 300-500 words. Figures with appropriate captions, and references, can be included, they do not count in the word limit. More information can be found at www.empc2023.org.