Call For Papers - The World's Largest Index/List of Call For Papers

2027 10th International Conference on Materials Design and Applications (ICMDA 2027)

ICMDA 2027

URL: https://www.icmda.org/
Event Date: 2027-04-08 ~ 2027-04-11
Submission Date: 2027-02-20
Location: Hiroshima, Japan

* Full Name: 2027 10th International Conference on Materials Design and Applications (ICMDA 2027)

* Abbreviation: ICMDA 2027

* Conference Venue: Hiroshima, Japan

* Conference Date: April 8-11, 2027

* Conference Website: www.icmda.org

* ICMDA focus on fundamental research and application areas in the field of the design and application of engineering materials, predominantly within the context of mechanical engineering applications.

* Publication:

Accepted and registered papers with presentation will be published in below listed journals of Scientific.Net collection.

Defect and Diffusion Forum (DDF) (ISSN print 1012-0386 / ISSN web 1662-9507)

Solid State Phenomena (SSP) (ISSN print 1012-0394 / ISSN web 1662-9779)

Materials Science Forum (MSF) (ISSN print 0255-5476 / ISSN web 1662-9752)

Key Engineering Materials (KEM) (ISSN print 1013-9826 / ISSN web 1662-9795)

Papers will be sent for indexing by Scopus, Inspec, Chemical Abstracts Service, Google Scholar etc.

* History:

ICMDA 2025: Vol. 1162. Materials Science Forum-ISBN: 978-3-0364-0958-0 | Indexed by Scopus

ICMDA 2024: Vol. 1128. Materials Science Forum-ISBN: 978-3-0364-0681-7 | Indexed by Scopus

ICMDA 2023: Vol. 1099. Materials Science Forum-ISBN: 978-3-0364-0438-7 | Indexed by Scopus

ICMDA 2022: Vol. 931. Key Engineering Materials-ISBN: 978-3-0357-2847-7 | Indexed by Scopus

ICMDA 2021: Vol. 324. Solid State Phenomena-ISBN: 978-3-0357-1859-1| Indexed by Ei Compendex & Scopus

ICMDA 2020: Vol. 1009, Materials Science Forum-ISBN: 978-3-0357-1688-7 | Indexed by Ei Compendex & Scopus

ICMDA 2019: Vol. 972, Materials Science Forum-ISBN: 978-3-0357-1530-9 | Indexed by Ei Compendex & Scopus

ICMDA 2018: Vol. 937, Materials Science Forum-ISBN: 978-3-0357-1377-0 | Indexed by Ei Compendex & Scopus

* Conference Committee

Conference Chair

Takashige Omatsu, Chiba University, Japan

Program Chairs:

Masahiro Nomura, The University of Tokyo, Japan

Kwang Leong Choy, Duke Kunshan University, China

Technical Program Chairs:

Yoshio Kobayashi, Ibaraki University, Japan

Anatoly Zinchenko, Nagoya University, Japan

Tomoya Oshikiri, Tohoku University, Japan

Publicity Committee:

Masayuki Nishi, Kyoto University of Advanced Science, Japan

Pengyong Hoo, Universiti Malaysia Perlis (UniMAP), Malaysia

Mohanad Alabdullah, Deakin University, Australia

Yu-Chih Tzeng, National Central University, Taiwan

......

More info about conference Committees: https://icmda.org/com.html

* Submission Method:

System Submission: https://confsys.iconf.org/submission/icmda2027

Email Submission: icmda@cbees.net

For more details, you can learn through: https://icmda.org/sub.html

* Call for Paper:

Track 1: Materials Design and Computational Engineering

Track 2: Advanced Functional Materials and Systems

Track 3: Materials Processing and Manufacturing Technologies

Track 4: Materials Characterization, Performance and Reliability

Track 5: Sustainable Materials and Energy Technologies

Track 6: Materials Applications for Intelligent and Emerging Engineering

For more information, please visit: http://www.icmda.org/cfp.html

* Contact Us:

Conference Secretary: Ms. Lynn

Email: icmda@cbees.net

Tel: +852-3155-4897/+86-28-87577778

Working Time: Monday - Friday; 9:30-18:00 (UTC/GMT+08:00)

Event Promotion

2027-08-25 ~ 2027-08-27

2027 10th International Conference on Materials Design and Applications (ICMDA 2027)

Event Promotion

Journal Promotion