IEEE 2025 8th International Conference on Advanced Electronic Materials, Computers and Software Engineering (AEMCSE 2025)

AEMCSE 2025


Computer Networks & Wireless Communication Computer Vision & Pattern Recognition Artificial Intelligence Engineering & Computer Science (General)



IEEE 2025 8th International Conference on Advanced Electronic Materials, Computers and Software Engineering (AEMCSE 2025) will be grandly held in Nanjing, China, from May 9-11, 2025.



 



Conference Website: https://ais.cn/u/73uUjy



 



---Call For Papers---



The topics of interest for submission include, but are not limited to:



1.Advanced Electronic Materials



· Nanomaterials and Nanotechnology



· Semiconductor Materials and Devices



· Electronic Packaging and Interconnection Technology



· Flexible electronics and smart wearable devices



· High Frequency Electronic Materials and Applications



......



 



2.Computers Engineering



· Artificial Intelligence and Machine Learning



· Edge Computing and Internet of Things (IoT)



· High-Performance Computing and Parallel Computing



· Computer Vision and Image Processing



· Computer Networking and Communications



......



 



3.Software Engineering



· Software Architecture and Design



· Software Testing and Quality Assurance



· Continuous Integration and Continuous Deployment



· Software Architecture and Design Patterns



· Cloud Computing and Service-oriented Architecture



......



 



---Publication---



All papers, both invited and contributed, will be reviewed by two or three experts from the committees. After a careful reviewing process, all accepted full papers will be published by IEEE(ISBN:979-8-3315-1091-6), and submitted to IEEE Xplore, EI Compendex and Scopus for indexing.



 



---Important Dates---



Full Paper Submission Date: April 8, 2025



Final Paper Submission Date: April 25, 2025



Registration Deadline: April 30, 2025



Conference Dates: May 9-11, 2025



 



--- Paper Submission---



Please send the full paper(word+pdf) to Submission System:



https://ais.cn/u/73uUjy