2023 Asia Conference on Electronics, Circuits, Systems and Signal Processing  (ECSSP 2023)

ECSSP 2023

Computing Systems Microelectronics & Electronic Packaging Signal Processing

2023 Asia Conference on Electronics, Circuits, Systems and Signal Processing

 (ECSSP 2023)


Website: http://www.ecssp.net/  

Venue: Kunming, China   

Conference Date: August 25-27, 2023


2023 Asia Conference on Electronics, Circuits, Systems and Signal Processing (ECSSP 2023) will be held in Kunming, China during August 25-27, 2023. It is sponsored by The International Society for Applied Computing (ISAC) and The Technical Institute for Engineers (T.I.E.).


During the upcoming conference, the invited renowned professors will share with us the recent innovations in the fields of Electronics, Circuits, Systems and Signal Processing. The conference will mainly feature on keynote speeches as well as peer-reviewed paper presentations. In addition, social program or academic visit will be arranged to encourage communication, discussion or cooperation among the researchers in this field.


We invite submissions of papers presenting an original high-quality research and development for the conference. All papers must be written in English and will be peer-reviewed by technical committees of the Conference and all accepted papers will be published in the conference proceedings.


*Conference Speakers:

Keynote Speaker I:

Prof. Witod Pedrycz, University of Alberta, Canada (IEEE Life Fellow)

Keynote Speaker II: Prof. Ljiljana Trajkovic, Simon Fraser University, Canada (IEEE Fellow)

Keynote Speaker III: Prof. Robert Minasian, The University of Sydney, Australia (IEEE Life Fellow)

Keynote Speaker IV: Chair Prof. (Kit) Kai-Kit Wong, University College London, UK (IEEE Fellow, IET Fellow)

Keynote Speaker V: Prof. Zhe Chen, Aalborg University, Denmark (IEEE Fellow)

Keynote Speaker VI:

Prof. Yang Han, University of Electronic Science and Technology of China, China

Keynote Speaker VII:

Prof. Hartmut Hinz, Frankfurt University of Applied Sciences, Germany


*Call for papers:

Integrated Circuit Design Theory and Technology

Electronic control and instrumentation

Embedded Systems

Circuits and Systems

Electronic device

Semiconductor devices and reliability

Physical Electronics and Optoelectronics

Electronic Devices in Communications

Industrial Automation and Control

VLSI Design and Fabrication

Photonic Technologies

Biomedical Electronics

Industrial Electronics and Automations

Digital Integrated Circuits and Systems

Power and Energy Circuits and Systems

Biomedical Circuits and Systems

Neural Networks and Neuromorphic Engineering

Digital Signal Processing

Multimedia Systems and Applications

Smart Systems for Automotive

Intelligent Security Systems

Cyber-Physical Systems

Sustainable Computing and Systems

Energy-aware Systems and Services

(for more topics: http://www.ecssp.net/Call%20for%20Papers.html )


*Publication and indexing:

ECSSP 2023 Conference Proceedings will be published by Conference Publishing Services (CPS), which will be submitted for inclusion in IEEE Xplore and CSDL. The ECSSP 2023 conference proceedings will also be submitted for indexing by EI Compendex, Scopus, and ISTP (CPCI).  


*Submission Methods:

1. Online Submission System: https://cmt3.research.microsoft.com/ECSSP2023 

2. Submission Email: ecssp@applied-computing.net 

Submission guidelines: http://www.ecssp.net/Submission%20Guidelines.html 


*Join the conference as:Authors:Authors are expected to submit full papers to the submission system for further review by our Technical Committees. All accepted papers after proper registration and presentation in the conference will be published and submitted for indexing.

Presenters Only: