Advances in Interconnect Technologies: An International Journal (AITIJ)


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Advances in Interconnect Technologies: An International Journal (AITIJ)

Call for Papers:

Advances in Interconnect Technologies: An International Journal (AITIJ) invites original and significant contributions relating to the theory, design, performance and reliability of interconnect, including materials, analysis, modeling and simulation of interconnect. The journal proposes to stimulate the development of latest technology in industry and academia. High quality review papers and short communications are also acceptable.

Research areas suitable for publication include, but are not limited to the following fields:

Topics of interest include, but are not limited to, the following

  • Emerging Materials

  • CNT/ Graphene Interconnects

  • Modeling and Simulation

  • Testing

  • RFIC

  • Optical Interconnects

  • Wireless Interconnects

  • Microstrip Lines

  • Analog and Mixed Signals

  • Dedicated Software and Systems for Developing Inter connect Technology

  • On-Chip and Off-Chip Interconnects



  • Fabrication Techniques

  • Neural Networks

  • Parasitics Issues

  • Optimization Techniques

Paper Submission

Authors are invited to submit papers for this journal through Email or Submission System. Submissions must be original and should not have been published previously or be under consideration for publication while being evaluated for this Journal.

Important Dates

  • Submission Deadline   : February 11, 2023

  • Notification                    : March 11, 2023

  • Final Manuscript Due    : March 20, 2023

  • Publication Date            : Determined by the Editor-in-Chief 

 Contact Us

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                    Submission System: