Advances in Interconnect Technologies: An International Journal(AITIJ)


Technology Law

Advances in Interconnect Technologies: An International Journal(AITIJ)


Scope & Topics

Advances in Interconnect Technologies: An International Journal (AITIJ) invites original and significant contributions relating to the theory, design, performance and reliability of interconnect, including materials, analysis, modeling and simulation of interconnect. The journal proposes to stimulate the development of latest technology in industry and academia. High quality review papers and short communications are also acceptable.


Topics of Interest include, but are not limited to, the following


  • Emerging Materials

  • CNT/ Graphene Interconnects

  • Modeling and Simulation

  • Testing

  • RFIC

  • Optical Interconnects

  • Wireless Interconnects

  • Microstrip Lines

  • Analog and Mixed Signals

  • Dedicated Software and Systems for Developing Interconnect Technology

  • On-Chip and Off-Chip Interconnects



  • Fabrication Techniques

  • Neural Networks

  • Parasitics Issues

  • Optimization Techniques


Paper Submission

Authors are invited to submit papers for this journal through E-mail: Submissions must be original and should not have been published previously or be under consideration for publication while being evaluated for this Journal.


Important Dates

  • Submission Deadline  : October 2, 2023

  • Notification         : November 2, 2023

  • Final Manuscript Due : November 10, 2023

  • Publication Date        : Determined by the Editor-in-Chief


Contact Us

Here's where you can reach us : or